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            Molecular-dynamics study of displacement cascades in Cu-Au solid solutions

            鄧輝舫 , H. F. Deng* and D. J. Bacon

            PHYSICAL REVEW B VOLUME 53, NUBER 17 1 MAY 1996-1,-0001,():



            A molecular-dynamics study has been made of the influence of solute content on low-energy displacement cascade processes in copper containing up to 15 at. % Au in solid solution. This alloy system was chosen to illustrate the effects of heavy, oversized solute atoms in a fcc matrix. Cascades of up to 2ke Vin energy were considered. The presence of the solute was found to have a significant impact on all phases of cascade development, but not on the final defect number. The ballistic phase is increased in duration, and the number of temporarily displaced atoms is increased by the solute, and the thermal spike that follows is also increased in intensity and duration. As a consequence, the atomic mixing associated with these two phases was highest in the Cu–15% Au alloy that contained the most solute. However, as a result of self-healing in the thermal spike, the final number of Frenkel defects is independent of alloy composition. To test the influence of solute atomic mass, simulations were carried out on copper containing solute atoms with the same size as Au, but a lighter mass than copper. The alloys with this fictitious element did not show the ballistic-and thermal-spike effects exhibited by those containing "normal" gold. The results are discussed in terms of the likely roles of solutes in damage evolution in alloys under cascade-producing irradiation.


            【免責聲明】以下全部內容由[鄧輝舫]上傳于[2009年06月09日 17時16分47秒],版權歸原創者所有。本文僅代表作者本人觀點,與本網站無關。本網站對文中陳述、觀點判斷保持中立,不對所包含內容的準確性、可靠性或完整性提供任何明示或暗示的保證。請讀者僅作參考,并請自行承擔全部責任。


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